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Plasma enhanced chemical vapor deposition (PECVD)
  • Plasma enhanced chemical vapor deposition (PECVD)
  • Plasma enhanced chemical vapor deposition (PECVD)
  • Plasma enhanced chemical vapor deposition (PECVD)
  • Plasma enhanced chemical vapor deposition (PECVD)
  • Plasma enhanced chemical vapor deposition (PECVD)

    Model:KJ-T1200-PECVD system

    Description:

    Plasma enhanced chemical vapor deposition (PECVD) is a thin film growth technology that uses glow discharge (plasma) to react thin films containing gaseous substances.

     
    Structure:
    Plasma enhanced chemical vapor deposition (PECVD) is a thin film growth technology that uses glow discharge (plasma) to react thin films containing gaseous substances. Our company designed this equipment according to experimental requirements, and the equipment is designed to meet the needs of various thin film research. The PECVD is equipped with spray towers and activated carbon boxes to meet the needs of exhaust gas treatment.
     
    Plasma enhanced chemical vapor deposition (PECVD)

    Technical Parameters:
    Model KJ-T1200-PECVD system
    Tube Furnace
    Part
    Display LED
    Chamber Split type and upper part can be opened
    Continuous Woking Temp. ≤1100℃
    Heating Rate Suggestion: 0~10℃/min (max. 20℃/min)
    Temperature Zone 300mm
    Heating Element Resistance Wire With Mo
    Thermocouple N type
    Temperature Control Accuracy ±1℃
    Tube Size 100 x 1500mm (OD x L) Approx.
    Material:High Purity Quartz
    Temperature Control PID automatic control
    Heating curves 30 steps programmable
    Vacuum Flange
     
    Stainless Steel vacuum flange with valve
    Plasma RF Power supply
     
     
    Output Power 5 -500W adjustable with ± 1% stability
    RF frequency 13.56 MHz ±0.005% stability
    Reflection Power 200W max.
    Matching
    Automatic
    RF Output Port 50 Ω, N-type, female
    Noise <50 dB.
    Cooling Air cooling.
    Vacuum Pump
     
    Diffusion Pump System Ultimate vacuum:10-5~10-6 Torr.
    And Inside tube vacuum: 10-3 Torr~10-4 Torr.
    Include Rotary pump, Diffusion pump, Vacuum gauge, Water cooler,Connecting pipe,Box,Valve.
    Mass Flow Meters
    (LCD Touch Screen)
    Two precision mass flow meters :
    MFC Accuracy is: ±1.5% F.S.
    MFC 1 for Nitrogen : Gas flow range from 0~500sccm
    MFC 2 for Argon : Gas flow range from 0~500sccm
    One gas mixing tank is installed on bottom case with 2 stainless steel needle valves is installed on left side of bottom case to control 2 type gases mixing manually.
    Exhaust gas treatment equipment 2 sets Spray tower
    2sets Activated carbon box
    1set Centrifugal blow


    More details picture:
    Plasma enhanced chemical vapor deposition
    Plasma enhanced chemical vapor deposition

     

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    Tel Number

    180-3717-8440

    Email

    web@kejiafurnace.com

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