●It can meet closed-tube dry oxygen oxidation, wet oxygen oxidation, hydrogen oxygen synthesis oxidation, diffusion, annealing at atmospheric pressure, annealing/propulsion, alloying and other processes
●Using high-reliability industrial control computer + PLC mode, automatic control of furnace temperature, advancing and retreating boat, gas flow, and valves are used to realize all process automation;
●With a friendly man-machine interface, users can easily modify the process control parameters, and can display various process status at any time;
●With a variety of process pipelines for users to choose conveniently;
●It has powerful software functions and is equipped with fault self-diagnosis software, which can greatly save maintenance time;
●Automatic adjustment of the constant temperature zone, cascade control, can accurately control the actual process temperature of the reaction tube;
●With over-temperature, broken couple, thermocouple short circuit, process gas flow deviation alarm and protection functions;
●Products can be customized according to user requirements.
●Applicable chip size: 2~8 inch wafer
●Working temperature: 600℃～1300℃;
●The number of process tubes that can be equipped: 1~4 tubes/set
●Length and accuracy of constant temperature zone: ≤±0.5℃/600~800mm (800℃～1300℃),
● Single-point temperature stability: ≤±0.5℃℃ /24h (1100℃);
●Temperature ramp capability: the maximum heating rate is 20℃/min, the maximum cooling rate is 5℃/min;
Semiconductor integrated circuits, advanced packaging, power electronics (IGBT), micromachines (MEMS), photovoltaic cells (Photovoltaic) manufacturing and other fields, suitable for 2~8 inch process size diffusion, oxidation, annealing and alloy processes.